Structured Glass Wafers are
available using Alpha's MicroBlast and Ultrasonic capabilities.
Alpha can offer various features including cavities, stepped holes,
alignment marks, ovals, crosses, and racetracks with denser patterns
and tighter tolerances.
Alpha offers a Precision Flatness Polishing
(PFP) process. PFP removes any roll off between the holes
that is caused by standard polishing processes. This gives you more
surface area for bonding with these dense patterns, less variation
from wafer to wafer, chip performance repeatability, and allows
you to further reduce your die size.
Rigid Carrier wafers used in
back side processing and back side thinning are available from Alpha.
These wafers are available with or without holes. The wafers with
holes allow for more uniform adhesive application with minimum air
pockets and quicker release when the processing is complete. Sample
wafers are available for your evaluation.
After you bond your wafer to Alpha's glass wafer, you can return
the two bonded wafers to Alpha to then further thin the glass wafer.
Alpha can produce back side streets and avenues to help with your
dicing of wafers. With MicroBlast,
Alpha can add slots to the back side of wafers. You can then saw
into the slots, allowing for shorter sawing times, less chipping
and higher yields.
By involving Alpha in the beginning of your design phase, we can
work together to help you design a wafer that fits your requirements
and your price target. Once specifications have been decided, Alpha
can generally have samples ready in 2-4 weeks.