Alpha Precision processes wafers up to a 300 mm diameter.

One of Alpha Precision's areas of expertise is polishing thin wafers. Alpha does production quantities of 150 mm diameter BoroFloat wafers at .254 mm thickness and has made wafers as thin as .170 mm.

Alpha Precision has added a new capability, MicroBlast. MicroBlast is a process that uses photolithography and dry etching to machine your unique pattern onto glass wafers. This process will complement Alpha's ultrasonic drilling expertise. MicroBlast will allow Alpha to produce smaller holes, channels, denser patterns, different shapes and hold tighter tolerances on thin glass wafers. Some of the new features offered are racetracks, ovals and crosses. MicroBlast allows Alpha to include alignment features to make your job easier. Current production is fabricating a 150 mm diameter wafer with alignment features to include over 10,000 features at .254 mm thickness. This process has no roll off between features. Extremely dense patterns can be produced with perfectly planar bonding surfaces.

MicroBlast enables Alpha to produce cavities and holes in glass wafers to be used as top caps to protect the top surface of silicon wafers. Allow Alpha's engineering team to assist you in designing a top cap wafer that fulfills your technical specifications and budget requirements.